Ceramic Semiconductor Packages

A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads.

Ceramic semiconductor packages.

These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest. High pin count semiconductor packaging. Three engineers from fairchild. For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs.

Miniature ceramic packages for crystal devices. These ceramic and metal can packages are of. Ceramic column grid array ccga. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements.

A package with metric pin distribution 0 5 mm pitch. However the simple construc. Ball spacing less than 1 mm. The pressed ceramic packages are typically lower in cost than the multilayer packages.

Is a world wide authorized distributor of packages and lids for ic assembly. Micro ball grid array μbga. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.

This was the first real semiconductor package. Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. The body of the component is ceramic.

Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap. Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. Located in silicon valley spectrum semiconductor materials inc. Dip packages came into volume production in early 70 s.

Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications. Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins.