Chip Carrier Ceramic

Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.

Chip carrier ceramic.

Package outline material information. Leadless ceramic chip carrier with heat sink package drawing eh ep view more. Leaded chip carriers have metal leads wrapped around the edge of the package in the shape of a letter j. Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.

12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf. 1st 2nd 3rd total seal ring die attach a x b c x d e x. Clcc ceramic leadless chip carrier mm inch unit. Chip carriers may be made of ceramic or plastic.

The leadless chip carrier s low profile and multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and on the bottom of the package. Chip carriers can be smaller than dual in line packages and since they use all four edges of the package they can have a larger pin count. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as jedec. Evergreen semiconductor materials esm is an independent distributor of ceramic ic packaging materials sockets esd protective packaging and silicon wafers.

Ldcc leaded chip carrier ej leaded ceramic chip carrier package drawing ej. The external lead frame is formed into a j shape to allow for socketing or direct board soldering. Leadless chip carriers continue to be a popular package for surface mount applications. Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.

Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering though sockets can be used for testing.